Thanks guys. Sealing the EPS core before laminating is new to me, but I've found some references now. My first 2 boards were PU (long time ago) and XPS, so that was not an issue. With the last board in EPS, that certainly would have been a good idea. I saw suggestion to use Polyfilla Big Holes patch, but I'm worried about that reducing strength, relative to using epoxy with q-cells and fumed silica.
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decrepit said..
The only problem with the first d-cell layer, is resin that squeezes out into the bag, this can puncture the bag if you reuse it.
I'm reconsidering using weights instead of vacuum. The XPS board eventually delaminated between the core and the d-cell layer, developing a big bubble. But I did not prep the XPS much, and may have used too little epoxy. That definitely happened with the EPS board, where I had to glue the sides down with Gorilla glue. But that board held up well.
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lemat said..
Yes vacuum bag lam allow an high fiber/resin ratio wich give best strengh/weight ratio, for tensil in fiber direction stress. Board skin mostly don't break because of tensil stress but because of buckling (flexural instability under compression) or shear impact. For those mechanical constraints ideal fiber/ratio is not the same.
The most common problem I've had with various purchased boards is punctures and dings from shells, small stones, etc. Are you saying that a bit more epoxy would be better to avoid this kind of damage? I don't care if the board ends up heavier if it ends up more ding resistant. My primary motivation to consider vacuum was to reduce bubbles (where it would work) and pin holes (where it may actually make things worse, according to decrepit).